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osp teflon flex-rigid pcb board

Layer: 10 Material: Aluminum, Pb free Thickness: 1. 6mm Copper:
Layer: 10 Material: Aluminum,Pb free Thickness: 1.6mm
post: luo870130
osp teflon flex-rigid pcb board

Layer: 10 Material: Aluminum, Pb free Thickness: 1. 6mm Copper:
Layer: 10 Material: Aluminum,Pb free Thickness: 1.6mm
post: luo870130
rigid-flex pcb board

Layer: 8 Material: FR4+PI Thickness: 1. 6mm Copper: 1oz
Layer: 8 Material: FR4+PI Thickness: 1.6mm Copper:
post: luo870130
rigid-flex for wireless charging module

The adapter£ºDC5V/ 2A DC9V/ 1. 67~2A output power£º5W(5V/ 1A) 10W
The adapter£ºDC5V/2A DC9V/1.67~2A output power£º5W(5V/1A
post: luo870130
4 layers 0.25mm fpc

Brand: Sunshine Good 4 layers FPC Layers: 1-4 layers Material
Brand: Sunshine Good 4 layers FPC Layers: 1-4 layers
post: luo870130
3 layers flex pcb

Two of 3-layer PCB 1 mil PI, 1ozCu, 1 mil overlay
Two of 3-layer PCB 1 mil PI, 1ozCu, 1 mil overlay
post: luo870130
gold finger fpc

High-precision product Arbitrary folding. Fold and turn around
High-precision product Arbitrary folding. Fold and tur
post: luo870130
gold finger fpc

High-precision product Arbitrary folding. Fold and turn around
High-precision product Arbitrary folding. Fold and tur
post: luo870130
four-layer flexible pcb

Material: FR-4+PI Layers(R+F):2R+2F layers Thickness:0. 24mm+1.
Material: FR-4+PI Layers(R+F):2R+2F layers Thickness:0
post: luo870130
four-layer flexible pcb

Material: FR-4+PI Layers(R+F):2R+2F layers Thickness:0. 24mm+1.
Material: FR-4+PI Layers(R+F):2R+2F layers Thickness:0
post: luo870130
4-layered heavy copper pcb for industrial

Layer: 4 Material: copper Thickness: 2. 0mm Copper: 3oz
Layer: 4 Material: copper Thickness: 2.0mm Copper:
post: luo870130
0.25mm fr-4 pcb

Fr4 2 layer (double layer) PCB 1305. 8*88. 9mm Layers: 2 Material:
Fr4 2 layer (double layer) PCB 1305.8*88.9mm Layers: 2 Ma
post: luo870130
rogers pcbs

Layer: 6 Material: Rogers Thickness: 1. 6mm
Layer: 6 Material: Rogers Thickness: 1.6mm
post: luo870130
8 layers thick pcb board

Material: FR4 Board thickness: 2. 4mm Copper thickness: 2 OZ fo
Material: FR4 Board thickness: 2.4mm Copper thickness:
post: luo870130
high power pcb

Layer: 2 layers Material: FR4 Tg170 Thickness: 1. 6mm +10%
Layer: 2 layers Material: FR4 Tg170 Thickness: 1.6mm +10%
post: luo870130
hdi pcbs

Layer: 10layer Base material: FR4(TG170) HDI stack-up: 1-2, 2
Layer: 10layer Base material: FR4(TG170) HDI stack-up:
post: luo870130
4 oz pcbs

Material: FR4 TG180 Layers: 6 layers Size: 122 X 120 mm
Material: FR4 TG180 Layers: 6 layers Size: 122 X
post: luo870130
6 layers immersion gold

FR4(Tg170) material, 1. 60mm thick, 1 OZ finished copper on all l
FR4(Tg170) material£¬ 1.60mm thick, 1 OZ finished copper on
post: luo870130
2 layers half hole pcbs

Layer: 2 Materials: , FR-4 PCB thickness: 1. 0¡À0. 1mm Final copper:
Layer: 2 Materials: ,FR-4 PCB thickness: 1.0¡À0.1mm Final
post: luo870130
plated gold pcbs

Layer: up to 30 layers Material: FR4, FR1, CAM1, 22F TG: 130-170
Layer: up to 30 layers Material: FR4, FR1, CAM1, 22F TG: 1
post: luo870130
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